Intel will say goodbye to the era ‘Tic-Tac’ in future generations of microprocessors and therefore a radical design change with the use of BGA form factor with micro soldier on the motherboard without reusability.
The next generation of Intel microprocessors, Intel Haswell, will come so fast, you know, Ivy Bridge ‘has the taken the months’.
And if Intel Haswell will be completely incompatible with all previous Intel platforms, with new socket LGA 1150 and new 8-series chipsets, which means that the user will need to buy besides motherboards processors, hold for the next generation.
It would Intel Broadwell, arriving in 2014 and a radical change in design since Intel would abandon the use of land grid array package (LGA) and micro pin grid array (μPGA) for form factors with micro BGA soldier in the motherboard and without possibility of exchanging or reusing micro or plate.
It seems good strategy for the user but Intel already using such connections in models like the Pentium MMX or currently with some Atom. Looks like the end enthusiast desktop will be safe from the BGA. All that remained was a micro-well plate as the Core i7-3970X EE and DX79SR are used only after paying $ 1,300. This was all regarding the upcoming Intel Haswell and Intel Broadwell processor.